Metal fusion bonding – Solder form
Reexamination Certificate
2006-04-04
2006-04-04
Johnson, Jonathan (Department: 1725)
Metal fusion bonding
Solder form
C363S015000
Reexamination Certificate
active
07021518
ABSTRACT:
The present invention provides a power micromagnetic integrated circuit having a ferromagnetic core, a method of manufacture therefor and a power processing circuit employing the same, that-includes: (1) a substrate; (2) an insulator coupled to the substrate and (3) a metallic adhesive that forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate.
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Kossives Dean P.
Lotfi Ashraf W.
Schneemeyer Lynn F.
Steigerwald Michael L.
Van Dover R. Bruce
Agere Systems Inc.
Johnson Jonathan
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