Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-02-25
1994-08-16
Powell, William
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156651, 156644, 156657, 1566611, 156662, H01L 21306, B44C 122, C03C 1500
Patent
active
053384008
ABSTRACT:
A process for forming a three-dimensional structure etched in a substrate with perfect convex corners includes partitioning the structure into two features such that the exterior corners are formed by the intersection of the two features; etching the first feature; forming an etch mask on the surface and on the substrate of the etched first feature; opening a window in the etch mask on the substrate to define the second feature; and etching the second feature, thereby obtaining the desired structure.
REFERENCES:
patent: 4286374 (1981-09-01), Hantusch
patent: 4417946 (1983-11-01), Bohlen et al.
patent: 4662984 (1987-05-01), Ohtake et al.
patent: 4733823 (1988-03-01), Waggener
patent: 4869780 (1989-09-01), Yang et al.
patent: 4981552 (1991-01-01), Mikkor
patent: 5124281 (1992-06-01), Ackerman et al.
patent: 5182227 (1993-01-01), Matsukawa
patent: 5204690 (1993-04-01), Lorenze et al.
Leone et al., Fabricating Shaped Grid and Aperture Holes, IBM Technical Disclosure Bulletin, vol. 14, No. 2, Jul. 1971, pp. 417-418.
IC Sensors Inc.
Powell William
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