Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Patent
1994-09-06
1997-03-04
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
257275, 333247, H01L 2312, H01P 100
Patent
active
056082630
ABSTRACT:
A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of semi-conductor material having a recess and receiving a metallized layer therebeneath and a second wafer of semi-conductor material having a groove in a bottom face against which is received a metallized layer. The first wafer metallized face is then adhesively bonded to the second wafer on a surface opposite the metallized layer to which a circuit is affixed. The second wafer metallized face and metallized grooves cooperate with the first wafer metallized face to provide a shielded circuit cavity therebetween. Alternatively, the first or second wafer can be used alone to partially shield a circuit element.
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Drayton Rhonda F.
Katehi Linda P. B.
Jr. Carl Whitehead
The Regents of the University of Michigan
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