Micromachined electromechanical device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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Reexamination Certificate

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07018862

ABSTRACT:
A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.

REFERENCES:
patent: 5962081 (1999-10-01), Ohman et al.
patent: 6093579 (2000-07-01), Sathe
patent: 6265750 (2001-07-01), Feng et al.
patent: 6612535 (2003-09-01), Tai et al.

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