Microlens manufacturing method

Details Microlens manufacturing method Microlens manufacturing method

2008-07-01

2008-07-01

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S071000, C257SE33068, C257SE31127

Reexamination Certificate

active

07393709

ABSTRACT:
The present invention provides a method for manufacturing a microlens in a semiconductor substrate having a first surface and a second surface, comprising the steps of preparing the semiconductor substrate, forming a first resist layer approximately cylindrical in form on the first surface of the semiconductor substrate, reflowing the first resist layer by heat treatment while holding the semiconductor substrate in such a manner that the first surface is normal to a vertical line and placed below the second surface, thereby to deform the first resist layer into a second resist layer approximately hemispherical in form, and simultaneously etching the second resist layer and the semiconductor substrate by means of anisotropic etching to form the corresponding lens in the semiconductor substrate.

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Schilling et al., “Surface profiles of reflow microlenses under the influence of surface tension and gravity,” Aug. 2000, Opt. Eng. 39(8) 2000 Society of Photo-Optical Instrumentation Engineers, pp. 2171-2176.
O'Neill et al., “Photoresist reflow method of microlens production: Modeling and fabrication techniques,” Sep. 2004, Photon Management, Proceedings of SPIE vol. 5456, pp. 197-208.
Wolf et al. “Silicon Processing for the VLSI era vol. 1: Process Technology,” 2000, Lattice Press, pp. 673-678.

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