Stock material or miscellaneous articles – Structurally defined web or sheet – Including variation in thickness
Patent
1997-04-30
1999-08-03
Loney, Donald
Stock material or miscellaneous articles
Structurally defined web or sheet
Including variation in thickness
428156, 428167, 428178, 428188, 264138, 264220, 264241, 156292, 15624419, 156297, 1563084, 261110, B32B 300, B28B 500, B01D 4700
Patent
active
059323159
ABSTRACT:
A microfluidic structure assembly having a microchannel formed by bonding two plates together is disclosed. The microfluidic structure assembly includes a first plate and a second plate. At least one of these plates has one or more microgrooves. Microdepressions and microprojections are also present in the plates and they connect such that the microprojections of one plate fit into the microdepressions of the other plate. As a result, the two plates are proximate to each other to form an assembly in which the microgrooves to form microchannels. These microdepressions and microprojections securely lock the microchannels into desired positions. Preferably the plates are made by molding to form the microdepressions, microgrooves, and microchannels.
REFERENCES:
patent: 4668607 (1987-05-01), Wojcik
patent: 4891120 (1990-01-01), Sethi et al.
patent: 4908112 (1990-03-01), Pace
patent: 5132012 (1992-07-01), Miura et al.
patent: 5194133 (1993-03-01), Clark et al.
patent: 5443890 (1995-08-01), Ohman
patent: 5500071 (1996-03-01), Kaltenbach et al.
patent: 5534328 (1996-07-01), Ashmead
patent: 5571410 (1996-11-01), Swedberg et al.
Fan et al., "Micromachining of Capillary Electrophoresis Injectors and Separators on Glass Chips and Evaluation of Flow at Capillary Intersections", 1994, vol. 66(1), pp. 177-184, Anal. Chem.
Manz et al., "Planar Chips Technology for Miniaturization of Separation Systems: A Developing Perspective in Chemical Monitoring", 1993, vol. 33, pp. 1-67, Advances in Chomatography.
Harrison et al., "Towards Miniaturized Electrophoresis and Chemical Analysis Systems on Silicon: An Alternative to Chemical Sensors", 1993, vol. B(10), pp. 107-116, Sensors and Actuators.
Manz et al., "Micromachining of Monocrystalline Silicon and Glass for Chemical Analysis Systems . . . ", vol. 10(5), pp. 144-149, Trends in Analytical Chemistry.
DuPont Electronics, "Pyralin PD Polymide Coatings PI-2700 Processing guidelines", 1991, pp. 1-12.
Manz et al., "Design of an Open-Tubular Column Liquid Chromatography Using Silicon Chip Technology", 1990, vol. B(1), pp. 249-255, Sensors and Actuators.
Becker et al., "Fabrication of Microstructures with High Aspect Ratios and Great Structural Heights by Synchrotron Radiation Lithography, Galvanoforning, and Plastic Moulding (LIGA Process)", 1986, pp. 35-56, Microelectronic Engineering (North-Holland).
Bean, "Anisotropic Etching of Silicon", 1978, vol. ED-25(10), pp. 1185-1193, IEEE Transactions on Electron Devices.
Declercq, "A New C-MOS Technology Using Anisotropic Etching of Silicon", 1975, vol. SC-10(4), pp. 191-1196, IEEE Journal of Solid-State Circuits.
Tenney et al., "Etch Rates of Doped Oxides in Solutions of Buffered HF", 1975, vol. 120(8), pp. 1091-1095, J. Electrohem. soc.: Solid State Science and Technology.
Theunissen et al., "Application of Preferential Electrochemical Etching of Silicon to Semiconductor Device Technology", vol. 1970, 117(7), pp. 959-965, ,J. Electrohem. soc.
Robbins et al., "Chemical Etching of Silicon, II", 1960, vol. 107(2), pp. 108-111,J. Electrohem.soc.
Robbins et al., "Chemical Etching of Silicon, I", 1959, vol. 106(6), pp. 505-508,J. Electrohem.soc.
Greenstein Michael
Lum Paul
Hewlett--Packard Company
Loney Donald
Yip Philip S.
LandOfFree
Microfluidic structure assembly with mating microfeatures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microfluidic structure assembly with mating microfeatures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microfluidic structure assembly with mating microfeatures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-847973