Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Patent
1996-07-24
1998-09-15
Martin, Roland
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
252 791, 252 794, B44C 122, C23F 100
Patent
active
058074937
ABSTRACT:
A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.
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Chemical Abstracts, No. JP-53030435.
Chemical Abstracts, No., JP-52110235.
Arimura Maki
Haruta Takashi
Maki Yoshiro
Nakagawa Toshiko
Yamada Yasushi
Martin Roland
MEC Co. Ltd.
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