Microetching composition for copper or copper alloy

Details Microetching composition for copper or copper alloy Microetching composition for copper or copper alloy

1997-01-24

1999-10-12

Utech, Benjamin

Etching a substrate: processes

Nongaseous phase etching of substrate

Etching inorganic substrate

216105, 252 792, 252 794, C09K 1300

Patent

active

059650362

ABSTRACT:
A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.

REFERENCES:
patent: 4695348 (1987-09-01), Battey et al.
patent: 5512201 (1996-04-01), Singh et al.
patent: 5532094 (1996-07-01), Arimura et al.
Patent Abstracts of Japan, vol. 018, No. 324, (E-1564), Jun. 20, 1994, JP 06 077095, Mar. 18, 1994 Endo.
Patent Abstracts of Japan, vol. 012, No. 306, (C-522), Aug. 19, 1988, JP 63 079983, Apr. 9, 1988 Hayashi et al.

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