Microetchant for copper surfaces and processes for using same

Details Microetchant for copper surfaces and processes for using same Microetchant for copper surfaces and processes for using same

1992-07-10

1994-07-12

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156640, 156664, 252 791, 252 795, H01L 2100

Patent

active

053285611

ABSTRACT:
An alkaline solution for the microetching of copper in the course of printed circuit manufacture is provided by combining components which are a source of cupric ion, ammonium hydroxide and/or a source of ammonium ion, and a compound, other than ammonia, which is a chelator for cupric ion in the alkaline environment of the solution. The microetchant composition is stable, brings about a desired microroughening of the copper surface with minimal removal of copper, is easily regenerated, and does not promote pink ring. When an organosilane through-hole conditioning agent is included in the composition, the composition can be used as a means for effecting in one step the microetching and conditioning steps of a printed circuit through-hole metallization process.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3532518 (1970-10-01), D'Ottavio
patent: 4209331 (1980-06-01), Kukanskis et al.
patent: 4279948 (1981-07-01), Kukanskis et al.
patent: 4319955 (1982-03-01), Murski
patent: 4409037 (1983-10-01), Landau
patent: 4515829 (1985-05-01), Deckert et al.
patent: 4597988 (1986-07-01), Kukanskis et al.
patent: 4608275 (1986-08-01), Kukanskis et al.
patent: 4622344 (1986-03-01), Babcock et al.
patent: 4751106 (1988-06-01), Wilkinson et al.
patent: 4756930 (1988-07-01), Kukanskis et al.
patent: 4844981 (1989-07-01), Landau
patent: 4863758 (1989-09-01), Rhodenizer
patent: 4976990 (1990-12-01), Bach et al.
patent: 5032427 (1991-07-01), Kukanskis et al.
patent: 5104687 (1992-04-01), Tomaiuolo et al.

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