Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2011-04-19
2011-04-19
Landau, Matthew C (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S686000, C257S777000
Reexamination Certificate
active
07928582
ABSTRACT:
Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces are disclosed. In one embodiment, a microelectronic assembly comprises a support member having a first side and a projection extending away from the first side. The assembly also includes a plurality of conductive traces at the first side of the support member. Some of the conductive traces include bond sites carried by the projection and having an outer surface at a first distance from the first side of the support member. The assembly further includes a protective coating deposited over the first side of the support member and at least a portion of the conductive traces. The protective coating has a major outer surface at a second distance from the first side of the support member. The second distance is approximately the same as the first distance such that the outer surface of the protective coating is generally co-planar with the outer surface of the bond sites carried by the projection. In several embodiments, a microelectronic die can be coupled to the corresponding bond sites carried by the projection in a flip-chip configuration.
REFERENCES:
patent: 5121299 (1992-06-01), Frankeny et al.
patent: 5245135 (1993-09-01), Schreiber et al.
patent: 5245750 (1993-09-01), Crumly et al.
patent: 5358826 (1994-10-01), Steitz et al.
patent: 6005290 (1999-12-01), Akram et al.
patent: 6114221 (2000-09-01), Tonti et al.
patent: 6137184 (2000-10-01), Ikegami
patent: 6166333 (2000-12-01), Crumly et al.
patent: 6229711 (2001-05-01), Yoneda
patent: 6259163 (2001-07-01), Ohuchi et al.
patent: 6271059 (2001-08-01), Bertin et al.
patent: 6288451 (2001-09-01), Tsao
patent: 6373273 (2002-04-01), Akram et al.
patent: 6462399 (2002-10-01), Akram
patent: 6528349 (2003-03-01), Patel et al.
patent: 6791186 (2004-09-01), Sorimachi et al.
patent: 6897088 (2005-05-01), Hedler et al.
patent: 6975035 (2005-12-01), Lee
patent: 7023088 (2006-04-01), Suzuki et al.
patent: 7205645 (2007-04-01), Nakamura et al.
patent: 7380338 (2008-06-01), Lee
patent: 2004/0087057 (2004-05-01), Wang et al.
patent: 2007/0138607 (2007-06-01), Mohammed et al.
patent: 2007/0296090 (2007-12-01), Hembree
patent: 2008/0048309 (2008-02-01), Corisis et al.
patent: 2008/0179758 (2008-07-01), Wong et al.
patent: WO-9963589 (1999-12-01), None
patent: WO-0001208 (2000-01-01), None
International Search Report and Written Opinion for PCT Application No. PCT/US2008/055817, Jul. 16, 2008.
Office Action issued Aug. 17, 2010 in People's Republic of China Application No. 200880007270.8, 17 pages.
Landau Matthew C
Micro)n Technology, Inc.
Mitchell James M
Perkins Coie LLP
LandOfFree
Microelectronic workpieces and methods for manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Microelectronic workpieces and methods for manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic workpieces and methods for manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2682289