Microelectronic packages and methods therefor

Details Microelectronic packages and methods therefor Microelectronic packages and methods therefor

2007-02-13

2007-02-13

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

With measuring or testing

C438S018000

Reexamination Certificate

active

11014439

ABSTRACT:
A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

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