Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-07-28
2008-09-02
Clark, S. V (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S027000
Reexamination Certificate
active
07419841
ABSTRACT:
Microelectronic imagers and methods for packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging unit can include a microelectronic die, an image sensor, an integrated circuit electrically coupled to the image sensor, and a bond-pad electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the die and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad with conductive fill material at least partially disposed in the passage. An electrically conductive support member is carried by and projects from the bond-pad. A cover over the image sensor is coupled to the support member.
REFERENCES:
patent: 3345134 (1967-10-01), Heymer et al.
patent: 4534100 (1985-08-01), Lane
patent: 4906314 (1990-03-01), Farnworth et al.
patent: 5130783 (1992-07-01), McLellan
patent: 5371397 (1994-12-01), Maegawa et al.
patent: 5424573 (1995-06-01), Kato et al.
patent: 5435887 (1995-07-01), Rothschild et al.
patent: 5505804 (1996-04-01), Mizuguchi et al.
patent: 5593913 (1997-01-01), Aoki
patent: 5605783 (1997-02-01), Revelli et al.
patent: 5672519 (1997-09-01), Song et al.
patent: 5694246 (1997-12-01), Aoyama et al.
patent: 5708293 (1998-01-01), Ochi et al.
patent: 5771158 (1998-06-01), Yamagishi et al.
patent: 5776824 (1998-07-01), Farnworth et al.
patent: 5811799 (1998-09-01), Wu
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5857963 (1999-01-01), Pelchy et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5877040 (1999-03-01), Park et al.
patent: 5897338 (1999-04-01), Kaldenberg
patent: 5914488 (1999-06-01), Sone
patent: 5977535 (1999-11-01), Rostoker
patent: 5998862 (1999-12-01), Yamanaka
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 6104086 (2000-08-01), Ichikawa et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6236046 (2001-05-01), Watabe et al.
patent: 6259083 (2001-07-01), Kimura
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6285064 (2001-09-01), Foster
patent: 6351027 (2002-02-01), Giboney et al.
patent: 6372548 (2002-04-01), Bessho et al.
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6411439 (2002-06-01), Nishikawa
patent: 6483652 (2002-11-01), Nakamura
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6541762 (2003-04-01), Kang et al.
patent: 6560047 (2003-05-01), Choi et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6603183 (2003-08-01), Hoffman
patent: 6617623 (2003-09-01), Rhodes
patent: 6661047 (2003-12-01), Rhodes
patent: 6667551 (2003-12-01), Hanaoka et al.
patent: 6670986 (2003-12-01), Ben Shoshan et al.
patent: 6686588 (2004-02-01), Webster et al.
patent: 6703310 (2004-03-01), Mashino et al.
patent: 6703689 (2004-03-01), Wada
patent: 6734419 (2004-05-01), Glenn et al.
patent: 6759266 (2004-07-01), Hoffman
patent: 6774486 (2004-08-01), Kinsman
patent: 6778046 (2004-08-01), Stafford et al.
patent: 6791076 (2004-09-01), Webster
patent: 6795120 (2004-09-01), Takagi et al.
patent: 6797616 (2004-09-01), Kinsman
patent: 6800943 (2004-10-01), Adachi
patent: 6813154 (2004-11-01), Diaz et al.
patent: 6825458 (2004-11-01), Moess et al.
patent: 6828663 (2004-12-01), Chen et al.
patent: 6828674 (2004-12-01), Karpman
patent: 6844978 (2005-01-01), Harden et al.
patent: 6882021 (2005-04-01), Boon et al.
patent: 6885107 (2005-04-01), Kinsman
patent: 6934065 (2005-08-01), Kinsman
patent: 6946325 (2005-09-01), Yean et al.
patent: 2002/0006687 (2002-01-01), Lam
patent: 2002/0057468 (2002-05-01), Segawa et al.
patent: 2002/0089025 (2002-07-01), Chou
patent: 2002/0096729 (2002-07-01), Tu et al.
patent: 2002/0113296 (2002-08-01), Cho et al.
patent: 2002/0145676 (2002-10-01), Kuno et al.
patent: 2003/0062601 (2003-04-01), Harnden et al.
patent: 2004/0012698 (2004-01-01), Suda et al.
patent: 2004/0023469 (2004-02-01), Suda
patent: 2004/0038442 (2004-02-01), Kinsman
patent: 2004/0041261 (2004-03-01), Kinsman
patent: 2004/0082094 (2004-04-01), Yamamoto
patent: 2004/0214373 (2004-10-01), Jiang et al.
patent: 2005/0052751 (2005-03-01), Liu et al.
patent: 2005/0104228 (2005-05-01), Rigg et al.
patent: 2005/0127478 (2005-06-01), Hiatt et al.
patent: 2005/0236708 (2005-10-01), Farnworth et al.
patent: 2005/0254133 (2005-11-01), Akram et al.
patent: 2005/0285154 (2005-12-01), Akram et al.
patent: 2006/0109366 (2006-05-01), Humpston et al.
patent: 2006/0202318 (2006-09-01), Satou et al.
patent: 2006/0286789 (2006-12-01), Sunohara et al.
patent: 2007/0057356 (2007-03-01), Chen
patent: 2007/0064317 (2007-03-01), Chen et al.
patent: 2007/0075324 (2007-04-01), Minamio et al.
patent: 0 886 323 (1998-12-01), None
patent: 1 157 967 (2001-11-01), None
patent: 2 835 654 (2003-08-01), None
patent: 59-101882 (1984-06-01), None
patent: 59-191388 (1984-10-01), None
patent: 07-263607 (1995-10-01), None
patent: 2001-077496 (2001-03-01), None
patent: WO-90/05424 (1990-05-01), None
patent: WO-02/075815 (2002-09-01), None
patent: WO-02/095796 (2002-11-01), None
patent: WO-2004/054001 (2004-06-01), None
U.S. Appl. No. 10/785,466, filed Aug. 25, 2005, Kirby.
U.S. Appl. No. 10/845,304, filed Nov. 17, 2005, Jiang et al.
U.S. Appl. No. 10/857,948, filed Dec. 8, 2005, Boettiger et al.
U.S. Appl. No. 10/863,994, filed Dec. 15, 2005, Akram et al.
U.S. Appl. No. 10/864,974, filed Dec. 15, 2005, Kirby et al.
U.S. Appl. No. 10/867,505, filed Dec. 15, 2005, Farnworth et al.
U.S. Appl. No. 10/879, 398, filed Dec. 29, 2005, Akram et al.
U.S. Appl. No. 10/879,838, filed Dec. 29, 2005, Kirby et al.
U.S. Appl. No. 10/893,022, filed Jan. 19, 2006, Hall et al.
U.S. Appl. No. 10/894,262, filed Jan. 19, 2006, Farnworth et al.
U.S. Appl. No. 10/901,851, filed Feb. 2, 2006, Derderian et al.
U.S. Appl. No. 10/910,491, filed Feb. 2, 2006, Bolken et al.
U.S. Appl. No. 10/915,180, filed Feb. 16, 2006, Street et al.
U.S. Appl. No. 10/919,604, filed Feb. 16, 2006, Farnworth et al.
U.S. Appl. No. 10/922,177, filed Feb. 23, 2006, Oliver et al.
U.S. Appl. No. 10/922,192, filed Feb. 23, 2006, Farnworth.
U.S. Appl. No. 10/925,406, filed Mar. 2, 2006, Oliver.
U.S. Appl. No. 10/925,501, filed Mar. 2, 2006, Oliver.
U.S. Appl. No. 10/925,502, filed Mar. 2, 2006, Watkins et al.
U.S. Appl. No. 10/927,550, filed Mar. 2, 2006, Derderian et al.
U.S. Appl. No. 10/927,760, filed Mar. 2, 2006, Chong et al.
U.S. Appl. No. 10/928,598, filed Mar. 2, 2006, Kirby.
U.S. Appl. No. 10/932,296, filed Mar. 2, 2006, Oliver et al.
U.S. Appl. No. 11/027,443, filed Jul. 6, 2006, Kirby.
U.S. Appl. No. 11/054,692, filed Aug. 10, 2006, Boemler.
U.S. Appl. No. 11/056,211, filed Aug. 10, 2006, Hembree et al.
U.S. Appl. No. 11/056,484, filed Aug. 10, 2006, Boettiger et al.
U.S. Appl. No. 11/061,034, filed Aug. 24, 2006, Boettiger.
U.S. Appl. No. 11/146,783, filed Oct. 20, 2005, Tuttle et al.
U.S. Appl. No. 11/169,546, filed Dec. 28, 2006, Sulfridge.
U.S. Appl. No. 11/169,838, filed Dec. 28, 2006, Sulfridge.
U.S. Appl. No. 11/177,905, filed Mar. 2, 2006, Akram.
U.S. Appl. No. 11/209,524, filed Mar. 2, 2006, Akram.
U.S. Appl. No. 11/217,169, filed Mar. 1, 2007, Hiatt et al.
U.S. Appl. No. 11/217,877, filed Mar. 1, 2007, Oliver et al.
U.S. Appl. No. 11/218,126, filed Mar. 1, 2007, Farnworth et al.
U.S. Appl. No. 11/218,243, filed Mar. 1, 2007, Kirby et al.
Aachboun, S. and P. Ranson, “Cryogenic etching of deep narrow trenches in silicon,” J. Vac. Sci. Technol. A 18(4), Jul./Aug. 2000, pp. 1848-1852.
Aachboun, S. and P. Ranson, “Deep anisotropic etching of silicon,” J. Vac. Sci. Technol. A 17(4), Jul./Aug. 1999, pp. 2270-2273.
Austin, M.D. and S.Y. Chou, “Fabrication of 70 nm channel length polymer organic thin-film transistors using nanoimprint lithography,” Applied Physics Letters, vol. 81, No. 23, pp. 4431-4433, Dec. 2, 2002, American Institute of Physics.
Blackburn, J.M. et al., “Deposition of Conformal Copper and Nickel Films from Supercritical Carbon Dioxide,” Science, vol. 294, pp. 141-145, Oct. 5, 2001.
Brubaker, C. et al., “Ultra-thick Litho
Akram Salman
Benson Peter A.
Farnworth Warren M.
Hembree David R.
Hiatt William M.
Clark S. V
Dickstein & Shapiro LLP
Micro)n Technology, Inc.
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