Microelectronic device with depth adjustable sill

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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Details

C257S018000, C257S190000, C257S191000, C257S192000

Reexamination Certificate

active

07078723

ABSTRACT:
A microelectronic device includes a substrate, and a patterned feature located over the substrate and a plurality of doped regions, wherein the patterned feature includes at least one electrode. The microelectronic device includes at least one sill region for the enhancement of electron and/or hole mobility.

REFERENCES:
patent: 5114871 (1992-05-01), Jones
patent: 6111267 (2000-08-01), Fischer et al.
patent: 6198135 (2001-03-01), Sonoda
patent: 6319799 (2001-11-01), Ouyang et al.
patent: 6512252 (2003-01-01), Takagi et al.
patent: 6537894 (2003-03-01), Skotnicki et al.
patent: 6541862 (2003-04-01), Amishiro et al.
patent: 6583000 (2003-06-01), Hsu et al.
patent: 6600170 (2003-07-01), Xiang
patent: 6759695 (2004-07-01), Ma et al.
patent: 6781163 (2004-08-01), Takagi et al.
patent: 6815735 (2004-11-01), Inoue et al.
patent: 6858534 (2005-02-01), Mouli
patent: 6900094 (2005-05-01), Hammond et al.
patent: 2001/0003364 (2001-06-01), Sugawara et al.
patent: 2003/0102490 (2003-06-01), Kubo et al.
patent: 2004/0036118 (2004-02-01), Abadeer et al.
patent: 2005/0087803 (2005-04-01), Hara et al.
Lu, Xiang, et al., “SiGe and SiGeC Surface Alloy Formation Using High-Dose Implantation and Solid Phase Epitaxy”, International Conference on Ion Implantation Technology, IEEE, 1997, pp. 686-689.
Nayak, Deepak K., et al., “High-Mobility Strained-Si PMOSFET's”, IEEE Transactions on Electron Devices, vol. 43, No. 10, Oct. 1996, pp. 1709-1716.
Selvakumar, C.R., et al., “SiGe-Channel n-MOSFET by Germanium Implantation”, IEEE Electron Device Letters, vol. 12, No. 8, Aug. 1991, pp. 444-446.
Wu, Y.H., et al., “High Temperature Formed SiGe P-MOSFET's with Good Device Characteristics”, IEEE Electron Device Letters, vol. 21, No. 7, Jul. 2000, pp. 350-352.
Yeo, Yee-Chia, et al., “Enhanced Performance in Sub-100 nm CMOSFETs Using Strained Epitaxial Silicon-Germanium”, International Electron Devices Meeting (IEDM), Dec. 10-13, 2000, pp. 753-756.

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