Microelectronic device fabrication method

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

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C438S169000, C438S172000, C438S570000, C438S571000, C438S597000, C438S598000, C257S025000, C257S027000, C257S030000, C257S054000, C257S183000, C257S183100, C257S267000, C257S280000, C257S281000

Reexamination Certificate

active

06929987

ABSTRACT:
In a method of forming a semiconductor device with a first channel layer formed over a portion of a second channel layer, a portion of the second channel underlying the first channel is etched so as to form an overhanging ledge in the first channel, and then a metallic contact disposed on top of the ledge portion is diffused into the first channel by ohmic alloying to form an electrode in the first channel.

REFERENCES:
patent: 4888626 (1989-12-01), Davey
patent: 4903092 (1990-02-01), Luryi et al.
patent: 5135880 (1992-08-01), Fisher et al.
patent: 5223449 (1993-06-01), Morris et al.
patent: 5270225 (1993-12-01), Goronkin et al.
patent: 5324682 (1994-06-01), Tserng
patent: 5405793 (1995-04-01), Ikalainen et al.
patent: 5406094 (1995-04-01), Arimoto et al.
patent: 5422505 (1995-06-01), Shirai
patent: 5453631 (1995-09-01), Onda et al.
patent: 5650642 (1997-07-01), Sawada et al.
patent: 6008509 (1999-12-01), Inai et al.
patent: 6057566 (2000-05-01), Eisenbeiser et al.
patent: 6080995 (2000-06-01), Nomoto
patent: 6110393 (2000-08-01), Simmons et al.
patent: 6458640 (2002-10-01), Li
patent: 6724025 (2004-04-01), Takashima et al.
patent: 6835969 (2004-12-01), Marsh et al.
patent: 6844227 (2005-01-01), Kubo et al.
C. Ladner et al. “Comparative investigation of gate leakage current in single and double channel InP HEMT” InP and related Materials, 1998 International conference May 1998 pp. 505-508.
T. Enoki et al. “InGaAs/InP double channel HEMT on InP” InP related Materials, 1992, fourth International conference, Apr. 21-24, 1992, pp. 14-17.

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