Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2005-07-28
2011-10-25
Im, Junghwa M (Department: 2811)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S051000, C438S053000, C257S704000, C257S710000, C257SE21001
Reexamination Certificate
active
08043880
ABSTRACT:
One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.
REFERENCES:
patent: 6635509 (2003-10-01), Ouellet
patent: 7067344 (2006-06-01), Oguchi
patent: 2004/0020782 (2004-02-01), Cohen et al.
patent: 2004/0100677 (2004-05-01), Huibers et al.
patent: 2004/0161871 (2004-08-01), Omori
patent: 2005/0263866 (2005-12-01), Wan
patent: 2006/0176487 (2006-08-01), Cummings et al.
Mund et al., Novel Microstructuring Technology for Glass on Silicon and Glass-Substrate, Electronic Components and Technology, IEEE 2004, pp. 939-942.
Mund, Dietrich, Novel Microstructuring Technology for Glass on Silicon and Glass-Substrates, 2004 Electronic Components and Technology Conference, IEEE, 2004, p. 939-942.
Haluzak Charles C
Sand Kirby
Sterner John R
Hewlett-Packard Development L.P.
Im Junghwa M
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