Microelectronic component with photo-imageable substrate

Details Microelectronic component with photo-imageable substrate Microelectronic component with photo-imageable substrate

2005-12-27

2009-12-15

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S014000, C438S017000, C438S107000, C438S118000, C438S123000, C257SE21503, C257SE21508, C257SE21511, C257SE23004, C257SE23021, C257SE23067, C257SE23068, C257SE23124, C257SE23062, C257SE25013

Reexamination Certificate

active

07632708

ABSTRACT:
Methods for making a microelectronic component including a plurality of conductive posts extending and projecting away from a flexible substrate, wherein at least some of the conductive posts are electrically connected to a plurality of traces exposed on the flexible substrate.

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