Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1997-03-03
1998-12-01
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257103, 257705, 257668, 257783, 257667, H01L 2348, H01L 2352, H01L 2940
Patent
active
058443193
ABSTRACT:
A microelectronic assembly (10) includes an integrated circuit component (14) attached to a polymeric substrate (12) by a plurality of unencapsulated solder bump interconnections (16). A collar (18) is affixed to the polymeric substrate (12) about the integrated circuit component (14) and is formed of an inorganic material having a coefficient of thermal expansion less than that of the substrate (12). The collar (18) constrains thermal expansion of the polymeric substrate (12) in the die attach region (22), thereby lessening any deleterious effects caused by a mismatch in the thermal expansion of the polymeric substrate (12) and the integrated circuit component (14).
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patent: 4664309 (1987-05-01), Allen et al.
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patent: 5089440 (1992-02-01), Christie et al.
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patent: 5220200 (1993-06-01), Blanton
patent: 5313365 (1994-05-01), Pennisi et al.
patent: 5386432 (1995-01-01), Rostoker
"Electronic Packaging and Interconnection Handbook", pp. 1.58, 1.59, 1.16, Harper, Nov. 1992.
"Electronic Packaging & Interconnection Handbook" pp. 732-734.
Bullock Brian J.
Carson George Amos
Gamota Danniel Roman
Wu Sean Xin
Clark Jhihan B.
Fekete Douglas D.
McIntyre John
Motorola Corporation
Saadat Mahshid D.
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