Microelectronic assemblies with composite conductive elements

Details Microelectronic assemblies with composite conductive elements Microelectronic assemblies with composite conductive elements

2005-02-01

2005-02-01

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S678000, C257S687000, C257S688000, C438S106000, C438S127000, C438S597000, C438S610000, C438S666000

Reexamination Certificate

active

06849953

ABSTRACT:
A microelectronic assembly includes composite conductive elements, each incorporating a core and a coating of a low-melting conductive material. The composite conductive elements interconnect microelectronic elements. At the normal operating temperature of the assembly, the low-melting conductive material melts, allowing the cores and microelectronic elements to move relative to one another and relieve thermally-induced stress.

REFERENCES:
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5204455 (1993-04-01), Gilleo et al.
patent: 5349500 (1994-09-01), Casson et al.
patent: 5436503 (1995-07-01), Kunitomo et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5666008 (1997-09-01), Tomita et al.
patent: 5705858 (1998-01-01), Tsukamoto
patent: 5708304 (1998-01-01), Tomita
patent: 5801446 (1998-09-01), DiStefano et al.
patent: 5802699 (1998-09-01), Fjelstad et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5885849 (1999-03-01), DiStefano et al.
patent: 5953623 (1999-09-01), Boyko et al.
patent: 5956235 (1999-09-01), Kresge et al.
patent: 5971253 (1999-10-01), Gilleo et al.
patent: 6043990 (2000-03-01), Johnson et al.
patent: 6086386 (2000-07-01), Fjelstad et al.
patent: 6191952 (2001-02-01), Jimarez et al.
patent: 6204455 (2001-03-01), Gilleo et al.
patent: 6208025 (2001-03-01), Bellaar et al.
patent: 6208156 (2001-03-01), Hembree
patent: 6324754 (2001-12-01), DiStefano et al.
patent: 6528894 (2003-03-01), Akram et al.
patent: WO 9740958 (1997-11-01), None

Affiliated with

Also associated with

Rating

Microelectronic assemblies with composite conductive elements does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic assemblies with composite conductive elements, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic assemblies with composite conductive elements will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3505657