Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2008-02-29
2010-11-09
Sefer, A. (Department: 2893)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S051000, C257SE31113, C257SE31124
Reexamination Certificate
active
07829366
ABSTRACT:
A microelectromechanical systems (MEMS) component20includes a portion32of a MEMS structure30formed on a semiconductor substrate34and a portion36of the structure30formed in a non-semiconductor substrate22. The non-semiconductor substrate22is in fixed communication with the semiconductor substrate34with the portion32of the MEMS structure30being interposed between the substrates34and22. A fabrication method96entails utilizing semiconductor thin-film processing techniques to form the portion32on the semiconductor substrate34, and utilizing a lower cost processing technique to fabricate the portion36in the non-semiconductor substrate22. The portions32and36are coupled to yield the MEMS structure30, and the MEMS structure30can be attached to another substrate as needed for additional functionality.
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Koury, Jr. Daniel N.
Liu Lianjun
Miller Melvy F.
Freescale Semiconductor Inc.
Meschkow & Gresham P.L.C.
Sefer A.
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