Measuring and testing – Fluid pressure gauge – Mounting and connection
Reexamination Certificate
2007-11-20
2007-11-20
Allen, Andre J. (Department: 2855)
Measuring and testing
Fluid pressure gauge
Mounting and connection
Reexamination Certificate
active
11495317
ABSTRACT:
According to some embodiments, an apparatus includes a substrate that defines a plane. The apparatus also includes a first conducting plate that is substantially normal to the substrate and a second conducting plate that is (i) substantially normal to the substrate and (ii) deformable in response to a pressure.
REFERENCES:
patent: 4092696 (1978-05-01), Boesen et al.
patent: 4287553 (1981-09-01), Braunlich
patent: 4530029 (1985-07-01), Beristain
patent: 6460234 (2002-10-01), Glanchandani
patent: 2004/0159158 (2004-08-01), Forster
patent: 4223616 (1992-07-01), None
patent: 1353161 (2002-10-01), None
EP Search Report Oct. 18, 2005.
J.-S. Park and Y. B. Gianchandani, “A Low Cost Batch-Sealed Capacitive Pressure Sensor,” IEEE No. 0-7803-5194-0 (1999).
A. V. Chavan and K. D. Wise, “A Monolithic Fully-Integrated Vacuum-Sealed CMOS Pressure Sensor,” IEEE No. 0-7803-5273-4 (2000).
Wen H. Ko and Qiang Wang, “Touch Mode Capacitive Pressure Sensors For Industrial Applications,” IEEE No. 0-7803-3744-1 (1997).
Hyeoncheol Kim and Kukjin Chun, “Integrated MEMS for Pressure Transponder,” 1997 International Conference on Solid-State Sensors and Actuators, IEEE No. 0-7803-3829-4 (1997).
W. P. Eaton and J. H. Smith, “Micromachined Pressure Sensors: Review and Recent Developments,” Smart Mater. Struct. 6, p 530-539 (1997).
Abhijeet V. Chavan and Kensall D. Wise, “A Monolithic Fully-Integrated Vacuum-Sealed CMOS Pressure Sensor,” IEEE Transactions on Electron Devices, vol. 49, No. 1 (Jan. 2002).
C. Hierold et al., “Implantable Low Power Integrated Pressure Sensor System for Minimal Invasive Telemetric Patient Monitoring,” IEEE No. 0-7803-4412-X (1999).
Fortin Jeffrey
Kishore Kuna
Subramanian Kanakasabapathi
Allen Andre J.
Brueske Curtis B.
General Electric Company
Powell, III William E.
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