Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2005-01-18
2005-01-18
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S026000, C438S029000, C438S030000, C438S050000, C438S057000, C257S773000, C257S776000, C257S775000, C257S625000, C257S419000, C439S852000, C439S856000, C439S081000, C439S082000
Reexamination Certificate
active
06844214
ABSTRACT:
A microelectromechanical system (MEMS) based sensor comprises: a substrate defining a plane; a first conductive material layer having a first stress, a first portion of the first conductive material layer being connected to the substrate and extending in a substantially parallel direction to the plane defined by the substrate and a second portion being disconnected from the substrate and extending in a substantially non-parallel direction to the plane defined by the substrate; and a sensor material layer formed over at least the second portion of the first conductive material layer, the sensor material layer having a second stress that is less than the first stress of the first conductive material layer. The stresses form a stress gradient that bends the second portion of the first conductive material layer and the sensor material layer formed over the second portion of the first conductive material layer away from the substrate.
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Mei Ping
Street Robert A.
Sun Decai
Anya Igwe U.
Smith Matthew
Xerox Corporation
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