Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2007-09-25
2007-09-25
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
Reexamination Certificate
active
10985530
ABSTRACT:
A microelectromechanical (MEM) device includes a substrate, a suspension spring, a structure, and a release bridge. The suspension spring is coupled to, and suspended above, the substrate. The structure is coupled to the suspension spring and is resiliently suspended thereby above the substrate. The release bridge is coupled to the suspension spring. During sensor manufacture, the suspension spring and structure are suspended above the substrate by undergoing a release process. The release bridge is sized such that, during the release process, the structure and the suspension spring are released substantially simultaneously.
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Coleman W. David
Freescale Semiconductor Inc.
Ingrassia Fisher & Lorenz
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