Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate
2011-01-18
2011-01-18
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With window means
C257S686000, C257SE23081, C257SE31131, C438S660000, C438S663000
Reexamination Certificate
active
07872338
ABSTRACT:
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
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Brady III Wade James
Brill Charles A.
Louie Wai-Sing
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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