Microelectromechanical component and method for the...

Details Microelectromechanical component and method for the... Microelectromechanical component and method for the...

2004-05-24

2008-12-09

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C438S053000

Reexamination Certificate

active

07462919

ABSTRACT:
A microelectromechanical component and to a method for the production thereof is disclosed. In one embodiment, the microelectromechanical component has a pressure-sensitive semiconductor chip, which is covered in its pressure-sensitive region by a rubber-elastic layer and is arranged in a cavity housing and covered by a rubber-elastic covering. This rubber-elastic covering has a greater thickness than the rubber-elastic layer on the pressure-sensitive region.

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Mann J W ED “A computer-aided, spatially-selective protection technique for multichip module and chip-on-board devices” May 18-20, 1992, IEEE.

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