Microelectromechanical component

Details Microelectromechanical component Microelectromechanical component

2011-04-26

2011-04-26

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S414000, C257S416000, C257SE21499, C438S050000, C438S052000

Reexamination Certificate

active

07932568

ABSTRACT:
The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises, suitably bonded to each other, a microelectromechanical chip part sealed by a cover part, and at least one electronic circuit part. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

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patent: 2005/0218488 (2005-10-01), Matsuo
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patent: WO 2005/000733 (2005-01-01), None
patent: WO2005104228 (2005-11-01), None
International Search Report for International Application No. PCT/FI2006/050507, filed Nov. 21, 2006.

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