Microelectromechanical apparatus and method for producing...

Details Microelectromechanical apparatus and method for producing... Microelectromechanical apparatus and method for producing...

2011-08-30

2011-08-30

Fahmy, Wael M (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S415000, C257SE29324, C257SE21502

Reexamination Certificate

active

08008739

ABSTRACT:
A microelectromechanical apparatus (X) includes a microelectromechanical component (10), an insulating substrate (21), a through via (22c) disposed in the insulating substrate (21), a sealing member (30) and a conductive connecting member (40). The microelectromechanical device (10) has a semiconductor substrate (11), a microelectromechanical system (12) and an electrode (13) electrically connected to the microelectromechanical system (12). The sealing member (30) is made of glass, is disposed so as to enclose the microelectromechanical system (12) between the semiconductor substrate (11) and the insulating substrate (21), and hermetically seals the microelectromechanical system (12). The conductive connecting member (40) electrically connects the electrode (13) and an end of the through via (22c), at a position spaced away from the sealing member (30).

REFERENCES:
patent: 5668057 (1997-09-01), Eda et al.
patent: 6407482 (2002-06-01), Sakata et al.
patent: 6603238 (2003-08-01), Sakata et al.
patent: 2002/0008444 (2002-01-01), Sakata et al.
patent: 2002/0117937 (2002-08-01), Sakata et al.
patent: 2001-057436 (2001-02-01), None
patent: 2003-179085 (2003-06-01), None
patent: 2005-072419 (2005-03-01), None
patent: 2005-072420 (2005-03-01), None
patent: 2005-251898 (2005-09-01), None
patent: 100329246 (2002-03-01), None
Korean language office action dated Apr. 12, 2010 and its English language translation for corresponding Korean application 20087018469 lists the references above.

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