Microelectric packages including flexible layers and flexible ex

Details Microelectric packages including flexible layers and flexible ex Microelectric packages including flexible layers and flexible ex

1998-07-27

2000-05-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361750, 361761, 361764, 361777, 174254, 174261, 349150, 349152, H05K 111, H05K 706, G02F 11345

Patent

active

060612460

ABSTRACT:
The printed circuit board and tape carrier package of an LCD module are replaced with a microelectronic package that includes a substrate and a layer integrally formed on the substrate that is flexible relative to the substrate. The flexible layer includes at least one flexible extension that extends beyond the substrate. A plurality of conductive lines are included on the substrate that extend onto the flexible layer and extend along the flexible layer onto the at least one flexible extension. The conductive lines on the flexible extension are electrically connected to the data lines, the gate lines or both. Accordingly, tape carrier packages need not be used so that cost may be reduced. Moreover, separate operations to connect tape carrier packages to printed circuits boards may be eliminated, thereby improving reliability and/or cost of the device.

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