Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-08-31
2009-02-24
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C228S045000, C228S246000
Reexamination Certificate
active
07494913
ABSTRACT:
Microball delivery solutions for solder bumping are generally described. In this regard, according to one example embodiment, a microball delivery assembly includes a mask with at least two microball holder(s) to hold at least two different sizes of microball(s) that may correspond with at least two different-sized openings on a substrate, to provide simultaneous delivery of different-sized microballs upon a substrate.
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Chase H. Ryan
Jomaa Houssam
Nalla Ravi K.
Intel Corporation
Ortiz Kathy J.
Pert Evan
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