Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2008-05-20
2008-05-20
Nguyen, Cuong (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S107000, C438S110000, C438S667000, C257SE21008
Reexamination Certificate
active
07374972
ABSTRACT:
A micro package, a multi-stack micro package, and a manufacture method therefor are provided. A micro package according to the present invention includes a device substrate for mounting a devices, being a circuit module; a protection cap for protecting the device; bonding substances which, formed by patterning on predetermined areas on the device substrate, bond the device substrate and the protection cap; layers formed on a portion of the device substrate and a portion of the protection cap and exterior sides of the bonding substances; vias which are formed by etching away another portion of the protection cap, and electrically connected to an upper surface of the device substrate through the bonding substances; under barrier metals (UBMs) formed on the vias; and solder bumpers, being connection terminals for an external signal, formed on the UBMs. As stated above, the present invention has advantages of guaranteeing the hermetical sealing since the above layers prevent moisture absorption from outside at the same time of lowering possibility of damages to the device inside the package since the processing temperature drops below 150° upon wafer bonding due to the use of the polymer substance as a bonding substance.
REFERENCES:
patent: 6376280 (2002-04-01), Ruby et al.
patent: 7067354 (2006-06-01), Prabhu
patent: 7102238 (2006-09-01), Noma et al.
patent: 7294920 (2007-11-01), Chen et al.
patent: 2004/0137723 (2004-07-01), Noma et al.
Ham Suk-jin
Jeong Byung-gil
Kim Woon-bae
Kwon Jong-oh
Lim Ji-hyuk
Nguyen Cuong
Samsung Electronics Co,. Ltd.
Sughrue & Mion, PLLC
LandOfFree
Micro-package, multi-stack micro-package, and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micro-package, multi-stack micro-package, and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro-package, multi-stack micro-package, and manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2769688