Optical waveguides – With optical coupler – Switch
Reexamination Certificate
2007-04-10
2007-04-10
Pak, Sung (Department: 2874)
Optical waveguides
With optical coupler
Switch
Reexamination Certificate
active
10620119
ABSTRACT:
A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.
REFERENCES:
patent: 5096279 (1992-03-01), Hornbeck et al.
patent: 5721162 (1998-02-01), Schubert et al.
patent: 5757536 (1998-05-01), Ricco et al.
patent: 5923995 (1999-07-01), Kao et al.
patent: 6291317 (2001-09-01), Salatino et al.
patent: 6426282 (2002-07-01), Saigal et al.
patent: 6449079 (2002-09-01), Herrmann
patent: 6525864 (2003-02-01), Gee et al.
patent: 6533947 (2003-03-01), Nasiri et al.
patent: 6587613 (2003-07-01), De Natale
patent: 6711317 (2004-03-01), Jin et al.
patent: 6800210 (2004-10-01), Patel et al.
patent: 6946321 (2005-09-01), Yegnashankaran et al.
patent: 2001/0041381 (2001-11-01), Choi
patent: 2001/0551143 (2001-12-01), Atobe et al.
patent: 2002/0110312 (2002-08-01), Yang et al.
patent: 2002/0195673 (2002-12-01), Chou et al.
patent: 2003/0107794 (2003-06-01), Siekkinen et al.
patent: 2003/0118277 (2003-06-01), Yu et al.
patent: 2003/0122206 (2003-07-01), Bhattarai et al.
patent: 2003/0179986 (2003-09-01), Martin et al.
patent: 06-120336 (1994-04-01), None
patent: 08-106614 (1996-04-01), None
Graph of cure time vs. glass transition temperature for BCB (date unknown) Applicants admit the status of this graph as prior art for the limited purpose of examination of this application, but otherwise reserve the right to challenge the status of this publication as prior art.
Statement by Applicants (including Attachment A).
M. Jenkins, et al., Chemical and Structural Characterization of Silane Adhesion Promoting Films for Use in Microelectronic Packaging, Materials Research Society. Symp. vol. 629, pp. FF5.12.1-FF5.12.6 (2000).
F. Niklaus, et al., “Low-Temperature Wafer-Level Transfer Bonding,” Journal of Microelectromechanical Systems, vol. 10, No. 4, pp. 525-531 (Dec. 2001).
F. Niklaus, et al., “Void-Free Full Wafer Adhesive Bonding,” Department of Signals, Sensors and Systems, Royal Institute of Technology, Stockholm, Sweden (date unknown) Applicants admit the status of this publication as prior art for the limited purpose of examination of this application, but otherwise reserve the right to challenge the status of this publication as prior art.
S.K. Sampath, et al., “Rapid MEMS Prototyping using SU-8, Wafer Bonding and Deep Reactive Ion Etching,” IEEE (2001).
A. Jourdain, et al., “Investigation of the Hermeticity of BCB-Sealed Cavities for Housing (RF-)MEMS Devices,” IEEE, pp. 677-680 (2002).
T-K. Chou et al., “3D MEMS Fabrication Using Low-Temperature Wafer Bonding with Benzocyclobutene (BCB),” The 11thInternational Conference on Solid-State Sensors and Actuators, Munch, Germany (Jun. 2001).
J. Neysmith et al., “A Modular, Chip Scale, Direct Chip Attach MEMS Package: Architecture and Processing,” The International Journal of Microcircuits and Electronic Packaging, vol. 23, No. 4, pp. 474-480 (2000).
P.V. Dressendorfer, et al., “MEMS Packaging—Current Issues and Approaches,” 2000 International Conference on High-Density Interconnect and System Packaging (2000).
Product literature entitled “Cyclotene™ 4000 Series Advanced Electronic Resins (Photo BCB)—Processing Procedures for Cyclotene 4000 Series (Photo BCB Resins DS2100 Puddle Develop Process,” Cyclotene™ Advanced Electronic Resins, by Dow (revised May 3, 1999).
Product literature entitled “Cyclotene™ 4000 Series Advanced Electronic Resins (Photo BCB)—Processing Procedures for Cyclotene™ 4000 Series Photo BCB Resins—Immersion Develop Process,” Cyclotene™ Advanced Electronic Resins, by Dow (revised Apr. 2, 2001).
Product literature entitled “Cure and Oxidation Measurements for Cyclotene Advanced Electronic Resins,” Cyclotene™ Advanced Electronic Resins, by Dow (date unknown) Applicants admit the status of this publication as prior art for the limited purpose of examination of this application, but otherwise reserve the right to challenge the status of this publication as prior art.
G. Mittendorfer, et al., “Summary Study of BCB Coating Tests,” by EVG (date unknown) Applicants admit the status of this publication as prior art for the limited purpose of examination of this application, but otherwise reserve the right to challenge the status of this publication as prior art.
“Tutorial 1—Introduction to Flip Chi;p: What, Why, How,” web page by Flip Chips Dot Com (date of first publication unknown). Applicants admit the status of this publication as prior art for the limited purpose of examination of this application, but otherwise reserve the right to challenge the status of this publication as prior art.
S. Renard, “Wafer level Surface Mountable Chip Size Packaging for MEMS and ICs,” Micromachined Devices and Components VI, Proceedings of SPIE, vol. 4176 (2000).
H.H. Gatzen, “Dicing challenges in microelectronics and micro electro-mechanical systems (MEMS),” Microsystem Technologies, 7, pp. 151-154 (2001).
H.H. Gatzen, et al., “Advances in Dicing Wafers for Micro Electro-Mechanical Systems (MEMS),” Proceedings vol. 2, Micro.tec 2000, Hanover Germany (Sep. 2000).
Apanius Christopher
Goldman Kenneth G.
Guo Shuwen
O'Meara Timothy R.
Pohl James J.
Pak Sung
Rosemount Aerospace Inc.
Thompson Hine LLP
Wong Tina M
LandOfFree
Micro mirror arrays and microstructures with solderable... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micro mirror arrays and microstructures with solderable..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micro mirror arrays and microstructures with solderable... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3752662