Micro-miniature structures and method of fabrication thereof

Details Micro-miniature structures and method of fabrication thereof Micro-miniature structures and method of fabrication thereof

1992-09-21

1994-11-15

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430311, 430312, 430313, 430323, 430324, 156656, 156657, 1566591, 156662, 156663, G03C 500, B44C 122

Patent

active

053647424

ABSTRACT:
In the fabrication of a free-standing miniaturized structure in a range of about 10 to 20 .mu.m thick, a method based on a sacrificial system includes the steps of selecting a substrate material, depositing on the substrate material a sacrificial layer of material and patterning the sacrificial layer to define a shape. A photoresist layer of material is deposited on the sacrificial layer and patterned by contrast-enhanced photolithography to form a photoresist mold. Upon the mold there is plated a metallic layer of material. The electroplated structure conforms to the resist profile and can have a thickness many times that of conventional polysilicon microstructures. The photoresist mold and the sacrificial layer are thereafter dissolved using etchants to form a free standing metallic structure in a range of about 10 to 20 .mu.m thick, with vertical to lateral aspect ratios of 9:1 to 10:1 or more.

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