Micro mechanical component and production process thereof

Details Micro mechanical component and production process thereof Micro mechanical component and production process thereof

1997-10-17

1999-08-24

Niebling, John F.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

438 52, 438 53, 438105, H01L 2100

Patent

active

059435550

ABSTRACT:
A micro mechanical component of the present invention comprises a base, and at least one drive portion supported on the base and relatively driving to the base, in which the drive portion is formed from a diamond layer. Thus, because the drive portion has excellent mechanical strength and modulus of elasticity, the operational performance can be greatly improved as a micro mechanical component processed in a fine shape, from the conventional level. Further, because the drive portion exhibits excellent device characteristics under severe circumstances, the range of applications as a micro mechanical component can be widely expanded from the conventional range.

REFERENCES:
patent: 5170668 (1992-12-01), Jones
Wolf, S. and Tauber, R.N., Silicon Processing for the VLSI Era, Lattice Press, pp. 531-534, 1986.

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