Micro-fluid ejection head containing reentrant fluid feed slots

Details Micro-fluid ejection head containing reentrant fluid feed slots Micro-fluid ejection head containing reentrant fluid feed slots

2007-04-10

2007-04-10

Norton, Nadine G. (Department: 1765)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S713000, C438S714000, C438S719000

Reexamination Certificate

active

11002453

ABSTRACT:
A method of micro-machining a semiconductor substrate to form through slots therein and substrates made by the method. The method includes providing a dry etching chamber having a platen for holding a semiconductor substrate. During an etching cycle of a dry etch process for the semiconductor substrate, a source power is decreased, a chamber pressure is decreased from a first pressure to a second pressure, and a platen power is increased from a first power to a second power. Through slots in the substrate provided by the method can have a reentrant profile for fluid flow therethrough.

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