Micro-element package and manufacturing method thereof

Details Micro-element package and manufacturing method thereof Micro-element package and manufacturing method thereof

2006-10-23

2009-11-10

Chen, Jack (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S460000, C438S118000, C257SE23193

Reexamination Certificate

active

07615397

ABSTRACT:
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.

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