Micro-electromechanical die module with planarized thick film la

Details Micro-electromechanical die module with planarized thick film la Micro-electromechanical die module with planarized thick film la

1994-10-17

1997-09-09

Breneman, R. Bruce

Etching a substrate: processes

Etching of semiconductor material to produce an article...

216 27, 216 33, 216 88, 298901, 347 65, B24B 100, B41J 204

Patent

active

056652496

ABSTRACT:
An improved microelectromechanical device, such as a thermal ink jet die or printhead, is formed by the alignment of two planar substrates bonded together by an intermediate thick film layer of patterned polymeric material, such as polyimide. The improved device has a fully cured, patterned thick film layer which is planarized by chemical-mechanical polishing-to improve the bonding strength between the substrates. The planarization removes topographical formations generated during the deposition of the thick film layer and/or during the patterning of the recesses therein.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4638337 (1987-01-01), Korpey et al.
patent: 4678529 (1987-07-01), Drake et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4789425 (1988-12-01), Drake et al.
patent: 4944836 (1990-07-01), Beyer et al.
patent: 5057853 (1991-10-01), Fisher
patent: 5131968 (1992-07-01), Wells et al.
patent: 5169472 (1992-12-01), Goebel
patent: 5318652 (1994-06-01), Hocker et al.
patent: 5336319 (1994-08-01), Narang et al.
patent: 5547094 (1996-08-01), Bartels et al.
patent: 5557308 (1996-09-01), Chandrasekaran
patent: 5582678 (1996-12-01), Komuro
Harendt et al, "Wafer bonding for intelligent power ics: integration of vertical structures" Proceedings 1995 IEEE Intl. SOI Cong. pp. 152-153 Oct. 1995.
Article by P. Singer entitled "Chemical-Mechanical Polishing: A New Focus On Consumables", pp. 45-52, Semiconductor Intl, Feb. '94.
Article by R. Iscoff entitled "CMP Takes A Global View", pp. 72-78, Semiconductor Int'l., May '93.
Article by S. Sivaram et al. entitled "Overview of Planarization by Mechanical Polishing of Interlevel Dielectrics", pp. 606-614, ULSI Science and Technology, Electro Chemical Society, '91.

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