Micro-electro-mechanical system (MEMS) sensor and method for...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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C257S254000, C257S415000, C257S419000, C438S022000, C438S024000, C438S048000, C438S052000, C438S053000, C216S002000, C216S011000, C216S075000, C216S079000, C381S174000, C073S066000, C073S464000, C073S514220, C073S570000, C073S574000, C073S575000, C073S584000, C073S777000, C073S780000

Reexamination Certificate

active

08071413

ABSTRACT:
The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion of which is at least partially separated from a portion of the suspended structure; wherein the suspended structure and the upper structure are separated from each other by a step including metal etch.

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