Micro-electro mechanical device made from mono-crystalline silic

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

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438 52, 438 53, 438725, 257417, 216 2, H01L 2100, H01L 21302, H01L 21461, H01L 2982, B24B 100

Patent

active

060603364

ABSTRACT:
A micro-electro-mechanical device and method of manufacture therefore with a suspended structure formed from mono-crystalline silicon, bonded to a substrate wafer with an organic adhesive layer serving as support and spacer and the rest of the organic adhesive layer serving as a sacrificial layer, which is removed by a dry etch means. Said substrate wafer may contain integrated circuits for sensing and controlling the device.

REFERENCES:
patent: 3626256 (1971-12-01), Brown
patent: 5314572 (1994-05-01), Core et al.
patent: 5576250 (1996-11-01), Diem et al.
patent: 5710057 (1998-01-01), Kenney
patent: 5725729 (1998-03-01), Greiff
patent: 5780885 (1998-07-01), Diem

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