Micro device and process for producing it

Details Micro device and process for producing it Micro device and process for producing it

2005-10-11

2005-10-11

Schillinger, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C438S693000, C438S694000, C430S005000, C378S035000, C378S034000

Reexamination Certificate

active

06953751

ABSTRACT:
A micro device comprising a SU-8 photoresist layer adhered to a thin layer of, for example, silicon nitride, silicon oxide, metal, and diamond. The SU-8 layer is clamped on the thin layer by using an under-etching technique.

REFERENCES:
patent: 6178221 (2001-01-01), Levinson et al.
patent: 6391523 (2002-05-01), Hurditch et al.
patent: 6482553 (2002-11-01), Gottert et al.
patent: 6821896 (2004-11-01), Shih
patent: 09205271 (1997-08-01), None
An article entitled, “SU-8 Thick Photoresist Processing . . . ,”, By Conradie et al., published by J. Micromech. Microeng., vol. 12, (2002), pp. 368-374.
An article entitled “Robust Parylene-To-Silicon Mechanical Anchoring”, By Liger et al., published by California Institute of Technology, (2003), pp. 602-605.

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