Micro camera module and method of manufacturing the same

Details Micro camera module and method of manufacturing the same Micro camera module and method of manufacturing the same

2006-06-28

2010-06-01

Zarneke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S459000, C257SE31124

Reexamination Certificate

active

07728398

ABSTRACT:
A semiconductor chip constituting an image pickup device is provided on a substrate and includes a connection terminal and an image pickup portion. A lens sheet having a lens portion is provided on the semiconductor chip. A groove is formed in at least the substrate to expose the connection terminal. A conductor pattern is formed in the groove and has one end electrically connected to the connection terminal.

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