Etching a substrate: processes – Forming or treating optical article
Patent
1997-12-08
2000-06-06
Gulakowski, Randy
Etching a substrate: processes
Forming or treating optical article
216 2, 216 33, 216 99, 385 88, G02B 6136, B29D 1100
Patent
active
060714263
ABSTRACT:
Micromachining of bulk silicon utilizing the parallel etching characteristics of bulk silicon and integrating the parallel etch planes of silicon with silicon wafer bonding and impurity doping, enables the fabrication of on-chip optics with in situ aligned etched grooves for optical fibers, micro-lenses, photodiodes, and laser diodes. Other optical components that can be microfabricated and integrated include semi-transparent beam splitters, micro-optical scanners, pinholes, optical gratings, micro-optical filters, etc. Micromachining of bulk silicon utilizing the parallel etching characteristics thereof can be utilized to develop miniaturization of bio-instrumentation such as wavelength monitoring by fluorescence spectrometers, and other miniaturized optical systems such as Fabry-Perot interferometry for filtering of wavelengths, tunable cavity lasers, micro-holography modules, and wavelength splitters for optical communication systems.
REFERENCES:
patent: 5248379 (1993-09-01), Bol
patent: 5761350 (1998-06-01), Koh
patent: 5872880 (1999-02-01), Maynard
patent: 5891747 (1999-04-01), Farah
Deri Robert J.
Lee Abraham P.
McConaghy Charles F.
Pocha Michael D.
Ahmed Shamim
Carnahan L.E.
Gulakowski Randy
The Regents of the University of California
Thompson Alan H.
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