Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2006-11-28
2006-11-28
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S127000
Reexamination Certificate
active
07141452
ABSTRACT:
Methods of forming microelectronic devices by disposing a radiation curable underfill material or adhesive material between a substrate and a microelectronic die, and exposing any radiation curable material which bleeds-out therefrom to radiation before or immediately after disposition, thereby reducing the extent of material bleed-out.
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patent: 5982041 (1999-11-01), Mitani et al.
patent: 6214635 (2001-04-01), Akram et al.
patent: 6582993 (2003-06-01), Baba et al.
patent: 6620649 (2003-09-01), Uchida
patent: 6759307 (2004-07-01), Yang
INTERTRONICS Technical Bulletins & Articles from http://www.intertronics.co.uk/general/bulletin.htm, 2 pages.
Swanson, Peter “Case Histories of Light Curing Adhesives in Electronics Manufacturing”, pdf file downloaded from link above at http://www.intertronics.co.uk/general/bulletin.htm, 14 pages.
Swanson, Peter “Advances in Photo Curing Adhesives and Coatings Lead to Process and Quality Benefits in Electronics Manufacturing”, html link at http://www.intertronics.co.uk/general/bulletin.htm, 13 pages.
Delaney Drew W.
Sambasivam Mahesh
Shojaie Saeed
Pert Evan
Winkle Robert G.
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