Methods of marking and electrically identifying an article

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29574, 29620, 29854, 324 73R, 324158F, G01R 1700

Patent

active

044372299

ABSTRACT:
A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles. The mark is typically altered by a current of sufficient magnitude to burn portions of the element (36), or by selective application of radiant energy such as a laser beam (83). Identifying the altered mark permits articles (12) having defective circuits thereon to be selectively eliminated from further processing steps.

REFERENCES:
patent: 3758745 (1973-09-01), Wilker et al.
patent: 3930304 (1976-01-01), Keller et al.
patent: 4255851 (1981-03-01), Fortuna
Bove; R., Hubacher; E. M., Savkar; A. A., "Impedance Terminator for AC Testing Monolithic Chips," IBM Tech. Disclosure Bull., vol. 15, No. 9, p. 2681, Feb. 73.

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