Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Patent
1998-02-02
1999-12-07
Niebling, John F.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
438158, 438159, H01L 2100
Patent
active
059982292
ABSTRACT:
Plasma treatment is performed on an exposed portion of an undoped amorphous silicon layer in a thin film transistor, after etching source/drain contacts and a doped amorphous silicon layer. The plasma treatment can repair damage caused during the etching. The plasma treatment is preferably a hydrogen plasma treatment, and more preferably a helium plasma treatment. These treatments are particularly useful in repairing damage when the source/drain electrodes comprise molybdenum or molybdenum/tungsten alloy, and etching is performed by dry etching the doped amorphous silicon layer using CF.sub.4 and HCl gases.
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Hong Mun-Pyo
Kim Sang-Gab
Lyu Chun-Gi
Lebentritt Michael S.
Niebling John F.
Samsung Electronics Co,. Ltd.
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