Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2006-12-27
2010-10-12
Ghyka, Alexander G (Department: 2812)
Semiconductor device manufacturing: process
With measuring or testing
C438S016000, C438S780000, C257SE21521
Reexamination Certificate
active
07811836
ABSTRACT:
A method of manufacturing a reference sample substrate for analyzing a metal contamination level includes coating an organic silica solution including metal impurities on a semiconductor substrate and forming an oxide layer on the semiconductor substrate by thermally treating the semiconductor substrate having the coated organic silica solution. The metal impurities are substantially uniformly distributed in the oxide layer and the metal impurities are positioned at predetermined portions of the oxide layer.
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English Abstract for Publication No. 06-249764.
English Abstract for Publication No. 11-132972.
English Abstract for Publication No. 2002-184828.
English Abstract for Publication No. 10-0388784.
Jun Pil-Kwon
Kim Mi-Ae
Lee Jae-Seok
Park Sun-Hee
F. Chau & Associates LLC
Ghyka Alexander G
Samsung Electronics Co,. Ltd.
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