Methods of making extrusion dies

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article

Reexamination Certificate

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C430S324000

Reexamination Certificate

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08076057

ABSTRACT:
Methods for making extrusion dies using a LIGA process, a German acronym for lithography (Lithographie), electroplating (Galvanoformung), and molding (Abformung), are described. The resulting extrusion dies can be used, for example, for extrusion of cellular ceramic substrates, precision extrusion of optical fiber or optical fiber precursors, or other applications where profile extrusion requires high dimensional precision and/or has otherwise intricate patterns.

REFERENCES:
patent: 5190637 (1993-03-01), Guckel
patent: 6517665 (2003-02-01), Boehme et al.
patent: 6989119 (2006-01-01), Bernas et al.
patent: 2005/0266262 (2005-12-01), Bonhote et al.
patent: 2007/0227893 (2007-10-01), Saucy
E. W. Becker et al.,Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding(LIGA process), Microelectronic Engineering, vol. 4, No., pp. 35-36 (May 1, 1986).
Ranjett B. Rao, et al.,Microfabricated deposition nozzles for direct-write assembly of three-dimensional periodic structures, Advanced Materials, vol. 17, No. 3, pp. 289-293 (Feb. 10, 2005).
Yuhua Guo, et al.,Investigation on overplating high-aspect-ratio microstructure, Proceedings of SPIE—The International Society for Optical Engineering 2006, vol. 6109, pp. 61090M-1-8 (2006).
“Amorphous Chalcogenide Inorganic Resist”, Akira Yoshikawa, Journal of Photopolymer Science and Technology, vol. 7, No. 3 (1994), pp. 577-584.
“Micro-Extrusion of Amorphous Alloy with Micro Die Fabricated by UV-LIGA Process”, Kurosawa et al., The Japan Society of Mechanical Engineers, NII-Electronic Library Service, 2000, pp. 249-250.
“Inorganic Resist Phenomena and Their Applications to Projection Lithography”, Leung et al., IEEE Transactions on Electron Devices, vol. ED-33, No. 2, 1986, pp. 173-181.
“Development of Inorganic Resists for Electron Beam Lithography: Novel Materials and Simulations”, Augustin Jeyakumar, A Thesis Presented to the Academic Faculty of the School of Chemical & Bimolecular Engineering, Georgia Institute of Technology, 2004.
“Chemical and physical aspects of the post-exposure baking process used for positive-tone chemically amplified resists”, Hinsberg et al., IBM J. Res. & Dev. vol. 45 No. 5, 2001, pp. 667-682.

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