Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Forming lateral transistor structure
Reexamination Certificate
2009-04-09
2011-10-25
Ahmadi, Mohsen (Department: 2812)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
Forming lateral transistor structure
C438S128000, C438S483000, C438S478000, C438S479000, C438S637000, C257SE21209, C257SE21662, C257SE21663, C257SE21687, C257SE21688
Reexamination Certificate
active
08043924
ABSTRACT:
In a method of forming a phase-change memory unit, a conductive layer is formed on a substrate having a trench. The conductive layer is planarized until the substrate is exposed to form a first electrode. A spacer partially covering the first electrode is formed. A phase-change material layer is formed on the first electrode and the second spacer. A second electrode is formed on the phase-change material layer. Reset/set currents of the phase-change memory unit may be reduced and deterioration of the phase-change material layer may be reduced and/or prevented.
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Jeong Gi-Tae
Jeong Hong-Sik
Park Jung-Hoon
Ryoo Kyung-Chang
Song Yoon-Jong
Ahmadi Mohsen
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
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