Methods of forming particle-containing materials

Details Methods of forming particle-containing materials Methods of forming particle-containing materials

2006-07-13

2009-12-08

Menz, Douglas M (Department: 2891)

Coating processes

Solid particles or fibers applied

Applying superposed diverse coatings or coating a coated base

C427S180000, C427S189000, C427S204000, C438S778000, C438S964000

Reexamination Certificate

active

07629024

ABSTRACT:
The invention includes methods of forming particle-containing materials, and also includes semiconductor constructions comprising particle-containing materials. One aspect of the invention includes a method in which a first monolayer is formed across at least a portion of a semiconductor substrate, particles are adhered to the first monolayer, and a second monolayer is formed over the particles. Another aspect of the invention includes a construction containing a semiconductor substrate and a particle-impregnated conductive material over at least a portion of the semiconductor substrate. The particle-impregnated conductive material can include tungsten-containing particles within a layer which includes tantalum or tungsten.

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