Methods of forming packaged micro-electromechanical devices

Details Methods of forming packaged micro-electromechanical devices Methods of forming packaged micro-electromechanical devices

2011-06-07

2011-06-07

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S052000, C438S121000, C438S455000, C438S456000, C438S460000, C257SE21499, C257SE21532, C257SE21705

Reexamination Certificate

active

07955885

ABSTRACT:
Methods of forming packaged micro-electromechanical devices include forming a first substrate having a micro-electromechanical device therein, which extends adjacent a first surface of the first substrate. A first surface of a second substrate is then bonded to the first surface of the first substrate, to thereby encapsulate the micro-electromechanical device within a space provided between the first and second substrates. Subsequent to bonding, a second surface of the second substrate is selectively etched to define at least one through-substrate opening therein, which exposes an electrode of the micro-electromechanical device. Thereafter, the through-substrate opening is filled with an electrically conductive through-substrate via.

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