Methods of forming nickel sulfide film on a semiconductor...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S674000, C257SE21575

Reexamination Certificate

active

07964490

ABSTRACT:
Embodiments of the present invention describe a method of forming nickel sulfide layer on a semiconductor device. A nickel sulfide layer is formed on a substrate by alternatingly exposing the substrate to a nickel-containing precursor and a sulfur-containing precursor.

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Gordon, “Atomic Layer Deposition (ALD): An Enabler for Nanoscience and Nanotechnology”, Harvard University Center for Nanoscale Systems, Jul. 29, 2008.

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