Methods of forming integrated circuits devices having pad...

Details Methods of forming integrated circuits devices having pad... Methods of forming integrated circuits devices having pad...

2007-04-17

2007-04-17

Lindsay, Jr., Walter (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21537

Reexamination Certificate

active

10823221

ABSTRACT:
Integrated circuit devices, for example, dynamic random access memory (DRAM) devices, are provided including an integrated circuit substrate having a cell array region and a peripheral circuit region. A buried contact plug is provided on the integrated circuit substrate in the cell array region and a resistor is provided on the integrated circuit substrate in the peripheral circuit region. A first pad contact plug is provided on the buried contact plug in the cell array region and a second pad contact plug is provided on the resistor in the peripheral circuit region. An ohmic layer is provided between the first pad contact plug and the buried contact plug and between the second pad contact plug and the resistor. Related methods of fabricating integrated circuit devices are also provided.

REFERENCES:
patent: 6040209 (2000-03-01), Roberts
patent: 6500724 (2002-12-01), Zurcher et al.
patent: 6656791 (2003-12-01), Shin et al.
patent: 6690082 (2004-02-01), Lakshmikumar
patent: 6693002 (2004-02-01), Nakamura et al.
patent: 6696368 (2004-02-01), Derraa et al.
patent: 6818469 (2004-11-01), Mori et al.
patent: 2003/0042607 (2003-03-01), Derraa et al.
patent: 2003/0075802 (2003-04-01), Derraa et al.
patent: 2003/0199152 (2003-10-01), Derraa
patent: 2004/0262661 (2004-12-01), Kim et al.

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